Solder ball shear
The xyztec Solder Ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress-free using the standard EZ controls. Precise shear height control and force measurement ensure accurate data with minimum distribution. Password-protected flexibility of the programmable test parameters allow you to be in control.
An optional camera system is available for visually inspecting the test result. Xyztec complies with all relevant international standards such as ASTM, MIL.
How to: solder ball shear
Close-up solder ball shear
Standards
- JEDEC JESD22-B117A for solder ball shear
Test features
- Sensor accuracy ±0.075%
- Shear height accuracy ±1µm
- Fast, destructive, inline testing of lead-free BGA’s
- Test speed from 5 mm/s to 50 mm/s
Failure modes
Failure in bulk material
- Bond strength not known
Pad failure
- Bond strength known
- Acceptability depends on the strength
Pad crater
- Pad strength known
- Acceptability depends on the strength
Bond failure
- Bond strength known
- Acceptability depends on the strength
- Probably weak bond
Failure in IMC
- Bond strength known
- Acceptability depends on the strength
