Efficient Hands-Free Bond Testing for 4″ to 8″ wafers
The Sigma W8 now features an integrated wafer loader that streamlines your testing process through automated handling. This practical solution automatically loads, aligns, and transfers wafers from cassette to bond tester, eliminating the need for manual intervention. With smart cassette mapping and empty slot detection, the system ensures reliable wafer management while reducing the risk of handling damage and operator error.
Hands-Free Testing Redefined
The new wafer loader integrates with the Sigma W8, enabling truly hands-free bond testing for 4″ to 8″ wafers. This innovative system automatically loads, aligns, and transfers wafers from cassettes to the bond tester without operator handling, dramatically reducing the risk of wafer damage and yield loss.
Key Features:
- Fully automated cassette mapping and wafer detection
- Intelligent empty slot recognition
- Safe and precise wafer handling
- Support for 4″ to 8″ wafers (up to 200 mm)
- Testing forces from 1 gf to 10 kgf
- High-precision XY stages (370 x 370 mm)
- Bump pitch capability down to 50 µm
Enhanced Automation for 6″ – 8″ Wafers
Our advanced software makes automated testing effortless. The intuitive interface allows operators to easily map cassettes and select multiple wafer slots for automated testing sequences. Combined with our Revolving Measurement Unit (RMU) housing up to 6 sensors, the system delivers continuous testing without operator intervention.
Maximize Your Production Efficiency
By eliminating manual wafer handling, the new loader system:
- Reduces the risk of wafer damage
- Minimizes operator errors
- Increases throughput
- Improves testing consistency
- Enhances overall yield
Elevate Your Testing Capabilities Today
The Sigma W8 with automated wafer loading represents the future of bond testing – where precision meets efficiency in a truly hands-free solution. Contact our team to discover how this technology can transform your testing operations.
