Tomorrow at around 13:30 local time, xyztec CTO Bob Sykes shall hold a keynote speech on “Recent and Future Advances in Bond Testing” at China Semiconductor Packaging Test Symposium (CSPT) in Nantong. More than 800 visitors are expected at this professional conference that focuses on Semiconductor Packaging & Testing.
China Semiconductor Packaging Test Symposium (CSPT)
CSPT has been held for 13 times already in several cities including Xi’an, Tianshui, Guangzhou, Lianyungang, Chengdu, Suzhou, Dalian, Wuxi, Shenzhen, Yantai, Beijing, Nanjing and Chongqing. Directed by Department of Electronics Information, the Ministry of Industry and Information Technology of the People’s Republic of China and Chinese Institute of Electronics is organized by China Semiconductor Industry Association. The 14th Conference will be held in Nantong （InterContinental Hotel Binjiang Nantongon June 15-18, 2016.
Bob Sykes, CTO of xyztec, is one of the leading authorities in bond testing world wide.
Update
The keynote speech by Bob Sykes was attended by about 1000 interested visitors. The audience among which many leading corporations that employ bond testing was very interested in the subjects presented. Click here to apply for a bond testing seminar.
