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可以轻轻的固定平坦或者是翘曲的晶圆.
主要是因为有PID控制具柔软和弹性末梢的顶针执行升降
在整个晶圆上料,固定,下料周期中, 其中真空的感应和切换被聪明的结合了升降顶针的位置.
针对极度翘曲的案例,可以选配晶圆翘曲下压装置来确保精准的固定.
为了保持异物远离晶圆或者是晶圆工作平台. 我们可以利用吹气装置与真空吸附装置. 或是利用沾黏滚轮在测试之前或测试之后进行清洁
针对300mm面板或是晶圆产品的真空夹具. 可以100%轻易到达300mm面板的任何一个位置不需要在平台上从新对位你的样品.晶圓承載平台帶有安全互鎖裝置,可360度旋轉。
轻松输入或输出不同wafer map文件格式,例如: KLARF, (S)INF, G85,或是其他格式让你可以完整地追溯. 缺陷或测试位置显示在wafer map中,直接点取画面可自动移动至点选位置来进行测试或分析。
自动推除异常桥接的big bump并清除残锡,以避免晶圆探针测试的损坏.
完全可编程的视觉算法,可以检查去除big bump是否成功
J.F. Kennedylaan 14b
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J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands