As 2024 comes to a close, we at xyztec want to take a moment to reflect on the milestones we have achieved and express our heartfelt gratitude for your continued interest and support. Whether you are a valued customer, a dedicated subscriber, or a (potential) partner, your engagement has played a significant role in making this year exceptional. It has been a year marked by game-changing innovations and significant strides that have strengthened our position as leaders in bond testing technology.
A Year of Breakthroughs and Achievements
Throughout 2024, we introduced numerous advancements that have redefined precision, speed, and automation in bond testing:
Enhanced Sigma Bond Testers
We unveiled key improvements to our Sigma bond testers product line, including better positional precision, unparalleled measurement accuracy, and increased speed for higher throughput (UPH). These upgrades, now standard on all newly purchased Sigma systems (except Sigma Lite), have equipped our customers to achieve unmatched performance and efficiency in their testing processes.
Force Detection Excellence
One of our standout unique selling points has been our unparalleled force detection system, which continues to set xyztec apart. Utilizing advanced 24-bit ADC technology, our Sigma bond testers deliver exceptional resolution, capturing even the most minute force variations with unmatched precision. This innovation provides over 16 million digital steps for a 1 kgf sensor and more than 4 million steps within a 250 gf range, far surpassing the capabilities of traditional 16-bit systems. Combined with high scanning rates and noise-free sampling, our systems ensure precise and reliable force measurements, empowering you to achieve superior results in bond testing.
Nano Control Shear Sensor
Achieving and maintaining precise shear height alignment has long been a challenge in bond testing. With the innovative nano control shear sensor, xyztec has set a new standard in this area. This patented sensor positions with an unprecedented 200 nm accuracy and maintains alignment throughout the test using a closed control loop and unique internal drive. The advanced design compensates for any variations during testing, ensuring stability and precision. Additionally, the sensor supports fast movement to the shear height, enhancing test throughput and efficiency. The Sigma bond tester records and tracks the shear height in real time, displaying it in the force graph for complete traceability. Equipped with programmable landing forces down to 5 gf, this technology empowers applications such as wafer-level testing, coating assessments, and lead frame evaluations. The nano control shear sensor’s precision and reliability make it the ideal solution for the most demanding bond testing challenges.
Automation Simplified
Bond testing automation has been elevated to new heights with the Sigma bond testers, making testing processes more efficient and reliable. With built-in automation capabilities, the Sigma systems minimize manual intervention and reduce error, boosting productivity. Advanced features like pattern recognition and camera technology enable automated wire detection, grading, and in-situ metrology, ensuring fast and accurate results. The Sigma software supports extensive customization options and in-house software development without added costs, adapting to specific customer requirements seamlessly. Our use of direct-drive motors across the full force range further enhances speed and precision, setting new benchmarks in the industry. From integrating barcode readers to tailored automation solutions, xyztec is dedicated to streamlining bond testing operations and maximizing performance.
Next-Generation Sigma High Force (HF) Bond Tester
We proudly introduced the revamped Sigma HF, setting a new benchmark for high-force, large-area bond testing. This enhanced platform, featuring a stable granite platform and innovative design updates, has already demonstrated its unmatched capabilities in industries around the world.
Looking Ahead to 2025
As we look to the future, we are excited about the innovative projects we work on in close collaboration with our customers. Together, we are exploring new solutions to address the evolving challenges of precision testing, especially in microelectronics. While we are keeping the details under wraps for now, we are confident that the advancements we are developing will continue to push the boundaries of quality, efficiency, and reliability in bond testing. Stay tuned for more updates as we work to shape the future of this industry!
If you have any bond testing challenges, please get in touch with us. We would love to collaborate and find the perfect solution for your needs.
Follow Us on New Social Platforms
We are expanding our presence and are excited to connect with you in new ways! In addition to Facebook, LinkedIn, X (Twitter), and YouTube, we are now active on Instagram, Threads, and Bluesky. Follow us on these exciting new platforms for the latest updates, industry insights, and exclusive behind-the-scenes content. Join the conversation and stay connected as we innovate and grow in 2025!
Wishing You a Wonderful Holiday Season
Thank you for being an essential part of our journey this year. Your support and trust inspire us to continually innovate and excel. We hope that our advancements have helped elevate your bond testing processes and contributed to your success. As we prepare to welcome the new year, we wish you a joyous holiday season filled with peace, happiness, and moments to cherish with your loved ones. May 2025 bring you prosperity, growth, and continued success.
Stay tuned for more innovations and continued excellence in 2025.
