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xyztec bv

Self aligning shear tool 6

Self-aligning shear tool

Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components..
Wire pull

How to: Wire Pull

We recently published How To: Wire Pull, a guide advising what to consider and how to best perform a Wire Pull test. The main focus of the manual..

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Self aligning shear tool 6

Self-aligning shear tool

Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bonds that change the shape of components..
Wire pull

How to: Wire Pull

We recently published How To: Wire Pull, a guide advising what to consider and how to best perform a Wire Pull test. The main focus of the manual..
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