Xyztec looks back on a very successful seminar together with Tianjin University on “Challenges and Opportunities in Packaging High-temperature Electronics”.
Challenges and Opportunities in Packaging High-temperature Electronics
This conference was visited by more than 80 people from leading companies in China, sharing knowledge. On behalf of co-host xyztec, Dirk Schade presented information about the latest possibilities in high force IGBT application testing.
Different users from different countries met and were excited to discuss new manufacturing and testing techniques. Among the other speakers on the event were Professor Guo-quan Lu from Tianjin University and representatives from Orthodyne Electronics.
The Sinter technology and Cu wire bonding attracted a lot of attention. The visitors of the seminar used the breaks between the various sessions for sharing experience.
