We proudly present our newest bond testing system, the Sigma W8. The Sigma W8 is the sister of the market-leading Sigma W12 bond tester to automatically test wafers from 4 to 8 inches (up to 200 mm).
This cost-effective wafer bondtester comes with the promising features of the standard Sigma bond tester, but with a larger work area and a unique wafer work holder. Combine the bond tester with an optional wafer (un)loader for fully automatic hands-free bond testing. The Sigma W8 is future-proof and upgradeable to a full Sigma W12.
Read about our promising functionalities in this newsletter or download the Sigma W8 flyer.
8 inch wafers bond tester
Sigma bond testers are modular by design and come with game-changing automation capabilities for automatic loading, testing and analyzing. The Revolving Measurement Unit (RMU) houses up to 6 sensors that enable continuous testing. The software includes vision and deep learning technology to eliminate human errors.
Full automation
Sigma bond testers are modular by design and come with game-changing automation capabilities for automatic loading, testing and analyzing. The Revolving Measurement Unit (RMU) houses up to 6 sensors that enable continuous testing. The software includes vision and deep learning technology to eliminate human errors.
Wafer loader
Integrate the Sigma W8 with an independent wafer (un)loader for hands-free bond testing. The wafer handler automatically loads, aligns, and transfers the wafers from the cassette onto the bond tester.
Lift pins
The system gently secures flat and warped wafers with the soft, flexible tips on the PID-controlled wafer lift pins.
Upgrade to Sigma W12
The Sigma W8 is upgradeable to the market-leading Sigma W12 bond tester, which can test wafers up to 12 inches (300 mm) fully automatically. The Sigma W12 comes with a 600 mm X stage to test bumps down to 20 µm. The upgrade possibility makes the Sigma W8 a future-proof investment.
