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Gently secure flat and warped wafers because of the soft, flexible tips on the PID controlled wafer lift pins. Vacuum sensing and switching are intelligently timed with the lift pin position throughout the load, clamp, and unload cycle.
In cases of extreme warpage, an optional wafer pusher ensures precise clamping. The high airflow of vacuum chucks pulls down wafers.
Keep test debris away from the wafer or the wafer chuck with a blower and vacuum cleaner or a roller with sticky foil, for pre- and post-cleaning.
Integration transforms the bond tester into a fully automated system. We offer various types of wafer handlers (Equipment Front End Module), for operator-free bond testing.
Vacuum work holder for panels or wafers up to 300 mm. Easily reach 100% of a 300 mm panel without repositioning your sample on the chuck. The wafer chuck work holder comes with safety interlocks and 360° rotation.
Easily import and export multiple file formats for wafer maps such as KLARF, (S)INF, G85, and others for full traceability. Defects or test positions are shown in an overview and are directly accessible for testing or analysis.
Automatically shear the big bumps and clean the debris to prepare for wafer probing. Fully programmable vision algorithms can check if the removal of big bumps was successful.
The solder that builds up in the cavity of the Cold Bump Pull (CBP) jaw reduces the gripping efficiency. This contactless cavity cleaner melts the solder with a high temperature and high-pressure air jet and then blows it into a fine matrix where it is absorbed.
Eliminate human error and save production costs.
Robotic handling ensures safe load and unload of applications and avoids handling error and damage. We offer handlers for:
The open Sigma software enables easy programming of total automation steps, positions, and commands. The automation editor employs camera visualization and intelligent wizards.
See the unseen with up to 3 live camera options. Bring out the features of interest with images or videos using high-resolution cameras, flexible LED illumination, and fantastic image processing options.
Recognition of components and fine pitch wires that are swept out of position due to process tolerances or part handling.
A Sigma offers 2 alternatives to make grading more efficient and consistent:
Improve data processing using automatic export and SECS/GEM for tracking and control.
The Revolving Measurement Unit (RMU) houses up to 6 flexible sensors that are configurable with various pull, peel, push, or shear tools. This enables continuous testing up to 200 kgf.
The Revolving Measurement Unit (RMU) houses up to 6 flexible sensors that are configurable with various pull, peel, push, or shear tools. This enables continuous testing up to 200 kgf.
The nano control shear sensor has a unique drive with a closed control loop within the shear sensor body. It improves the accuracy and stability of the shear height with a precision of 200 nm when testing critical applications such as wafer-level, coating, and lead frames.
| STAGES | SIGMA W12 |
|---|---|
| X-stage (mm) | 500 |
| Y-stage (mm) | 370 |
| Z-stage (mm) | 90 |
| Axis speed (mm/s) | 50 |
| Resolution linear encoders (backlash free drives) (nm) | 30 |
| Digital temperature correction |  |
| ACCURACY | |
| Accuracy (%) | 0.075 |
| ADC resolution (bit) | 24 |
| Sampling frequency (kHz) | 10 |
| Shear height (step back) accuracy ±1 μm | |
| Programmable landing force down to 5 gf | |
| MECHANICAL | |
| Footprint X (mm) | 1300 |
| Footprint Y (mm) | 935 |
| Height (mm) | 608 |
| Weight (± kg) | 100 |
Please contact us for more information and options for your factory. Specifications are subject to change without prior notice.
Standard 
Optional
Not available
Local support and parts, global presence, world-class testers
Netherlands
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Germany
Am Haupttor / Bürocenter
06237
Leuna
Germany
USA
170 Commerce Way
Suite 200
Portsmouth, NH 03801
United States
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan,
Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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