This week, xyztec is exhibiting at Productronica 2015 in München, Germany.
Wire detect
Many visitors stop by to see with their own eyes the new wire detect functionality, which is the next step forward in wire pull. The bond tester optically detects the wire and corrects for wire sweep before going on to pull the wire automatically. This ensures more repeatable positioning, consistency in your bond test results, fast test speed, and high accuracy.
Productronica 2015
Friday November 13th is the last day of Productronica 2015 in München, Germany. We invite you to come to our booth at A2 with number 119, have a look at the Sigma, the Sigma W12 that are there or to chat about the amazing new possibilities in the area of bond testing.
Click here to find out more about xyztec’s Sigma bond testers. The Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level.
