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A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).
Click the play button to see a pull test type video or read more by clicking on the link below.
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オランダ
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
ドイツ
Am Haupttor / Bürocenter
06237
Leuna
Germany
アメリカ
170 Commerce Way
Suite 200
Portsmouth, NH 03801
United States
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
台湾
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
蘇州
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan,
Jiang Su, China
該当地区の代理店に問い合わせ
Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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Herbert Stuermann
