On many applications, the placement of wires is inconsistent. Simple automation programs will miss the wire or pull two wires at once. The high-resolution cameras on a Sigma bond tester, combined with advanced wire detection algorithms, make it possible to correct for production tolerances for every single wire. Even in fine pitch bonding scenarios!
At the location of the green crosshairs, the illustration shows how the hook is driven to a corrected position after the bond tester detects the wire. When the bond tester performs the pull test, it does not miss the wire but pulls it in the same position as every other wire.
Automatic wire detection enables a higher degree of consistency over what is possible when testing manually.
J.F. Kennedylaan 14b
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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Herbert Stuermann
