China ID Packaging & Testing Industry Chain Innovation Development Summit

Summit Forum

This event carried out a variety of activities such as summit forums, roundtables, special seminars, information releases and technology demonstrations, setting up a platform for communication and cooperation in the industry, and providing opportunities for representatives of upstream and downstream enterprises in the industry chain to communicate and project docking. .

Special meetings

1. Semiconductor packaging and testing special equipment and materials ecological innovation cooperation forum

2. Special forum on advanced packaging and system integration