Xyztec is exhibiting this week at SMT Hybrid Packaging 2015 in Nürnberg, Germany. The xyztec stand has been busy all week, with the automatic wire detection functionality and the Sigma W12 for 12 inch wafer testing as the center of all attention.
SMT Hybrid Packaging 2015
The show will be open until Thursday May 7th, 17:00. Come and see the latest developments in bond testing, if you have the opportunity. Out booth has number 7A-507. Alternatively, click here to see which other shows xyztec will visit this year.
