Last week, xyztec attended the SMT show in Nürnberg, Germany. The technology leader in bond testing presented itself in two places, namely at booth 7A- 507 and at the “Production Line Future Packaging” in Hall 6. Traditionally, the show was predominantly attended by German visitors but xyztec also welcomed many people from Eastern and Central Europe, as well as Scandinavia.
For xyztec, SMT 2016 centered around automation, repeatability and the advantages there of for our customers. Also, the Sigma W12, which can be integrated with various wafer handlers (EFEM), generated a lot of traffic.
