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A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).
Click the play button to see a pull test type video or read more by clicking on the link below.
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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