Xyztec has been making significant strides in the microelectronics industry, and our recent participation in two premier events underscores our commitment to innovation and excellence. This week, we are thrilled to participate in the International Microelectronics Assembly and Packaging Society (IMAPS) conference in Scottsdale and the SEMICON China event in Shanghai.
Xyztec is Silver Sponsor at IMAPS 2024
At IMAPS, Xyztec proudly collaborated with BaiTech to showcase our cutting-edge technologies. The IMAPS conference, held at the WeKoPa Resort and Conference Center, brought together leading experts and professionals from around the globe. As silver sponsors of the 20th Annual Device Packaging Conference (DPC 2024), we were honored to contribute to this international gathering of minds. Our presence at IMAPS reflects our ongoing dedication to advancing microelectronics assembly and packaging.
SEMICON China
Meanwhile, at SEMICON China, we seized the opportunity to connect with the vibrant Chinese microelectronics market. SEMICON China is renowned for providing a platform to showcase the latest products and technologies to industry professionals. We extend a warm invitation to visit our distributors‘ booths at SEMICON China:
- Herofair booth N3123
- Raysun booth E3-3600
- Kingyoup booth N3176
- Extripod booth N5804
- Raysun E3600
- FTC booth N3631
Explore our bond testers and discover how Xyztec is shaping the future of microelectronics testing.
Thanks for Visiting
We are grateful to all who visited our stands and engaged with our team. Your support fuels our passion for innovation and reinforces our commitment to delivering unparalleled solutions to the microelectronics industry.
For those who missed us at IMAPS and SEMICON China, stay tuned for upcoming events where you can experience firsthand the transformative technologies that define Xyztec. Join us as we push the boundaries of possibility in microelectronics testing.
For more information about Xyztec and our products, please visit our website or contact us directly.
Together, let’s shape the future of microelectronics.
