The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. Xyztec, the technology leader in bond testing, was present to discuss and share information about fully automated bond testing.
ESTC Conference 2018
This international Electronics System-Integration Technology event brought together both academics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.
