A Premier Event.... The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The technical program contains papers covering […]

China ID Packaging & Testing Industry Chain Innovation Development Summit Summit Forum This event carried out a variety of activities such as summit forums, roundtables, special seminars, information releases and technology demonstrations, setting up a platform for communication and cooperation in the industry, and providing opportunities for representatives of upstream and downstream enterprises in the […]

Semiconductor Packaging & Testing Expo