IMAPS Wire Bonding 2025 Workshop & Tabletop Exhibition The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding ~ February 3-5, 2025 in San Diego, California.

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these […]

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.