The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!
Read more: https://www.imaps.org/device_packaging_conference.php
