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xyztec bv

Wafer-testing

Ball on ring

Ball on ring The ball-on-ring (BoR) test method is a crucial technique widely employed for characterizing the biaxial strength and axially symmetric bending of brittle materials such as..
Interconnection-levels

Connector Push

Connector Push Rigorous Connector Push Tests are conducted to assess the resilience and reliability of electromechanical connectors. These tests are essential for guaranteeing seamless electrical connections between subsystems,..

Keypad

https://xyztecvideos.b-cdn.net/Keypad%20test.mp4
bend test

Bending

Bending A bending test is designed to check the capability of the leads, lead welds, and seals of the devices to withstand stresses to the leads and seals..

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Wafer-testing

Ball on ring

Ball on ring The ball-on-ring (BoR) test method is a crucial technique widely employed for characterizing the biaxial strength and axially symmetric bending of brittle materials such as..
Interconnection-levels

Connector Push

Connector Push Rigorous Connector Push Tests are conducted to assess the resilience and reliability of electromechanical connectors. These tests are essential for guaranteeing seamless electrical connections between subsystems,..

Keypad

https://xyztecvideos.b-cdn.net/Keypad%20test.mp4
bend test

Bending

Bending A bending test is designed to check the capability of the leads, lead welds, and seals of the devices to withstand stresses to the leads and seals..
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