This Wednesday, December 8th, the Finnish IEEE CPMT chapter is organizing an one day seminar in Helsinki on „Current Topics on Board Level Reliability of Electronics“. Among other speakers Aubert Dupont, co-founder of xyztec, will speak. The emphasis will lay on the current and possible future methods for solder bond testing.
Date: December the 8th, 2010
Time: 14:00 – 17:40
Place: Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432.
Program:
| 14:00 | Opening of the seminar |
| 14:01 | “The Right Solder Paste for your Process” – Emmanuelle Guene – Inventec Performance Chemicals |
| 14:25 | “Solder Paste Residue Corrosivity Assessments” – Emmanuelle Guene – Inventec Performance Chemicals |
| 14:50 | “Optimization of the Surface Mount Process for Better Reliability” – Jussi Hokka – Aalto University |
| 15:15 | “Formation of Microstructures in SnAgCu Solder Interconnections” – Vesa Vuorinen – Aalto University |
| 15:40 | Coffee break |
| 16:00 | “Effects of Alloying Elements on the IMC layers – Case of Cu and Ni” – Vesa Vuorinen – Aalto University |
| 16:25 | “An Overview of Failure Mechanisms under Different Loading Conditions” – Toni Mattila – Aalto University |
| 16:50 | “An introduction to Bond Testing” – Aubert Dupont – XYZTEC |
| 17:15 | “Current and possible Future Methods for Solder Bond Testing” – Aubert Dupont – XYZTEC |
| 17:40 | Closing of the seminar |
