Semicon Taiwan 2021
TaiNEX 1 No. 1, Jingmao 2nd Road, Taipei City, Nangang District, TaiwanKingyoup M1148 SST K2270
Kingyoup M1148 SST K2270
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in […]
SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere. Get your free SMT ticket! Xyztec is exhibiting at the SMTconnect 2022 in Germany from 10-12th May, and […]
A Premier Event.... The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The technical program contains papers covering […]
PowerSemiconductorinternational conference 2022 - China 5th International New Energy Auto Power semiconductor technology Forum
11. DVS/GMM-Fachtagung Daten - Fluch oder Segen? Begriffe wie „Data-Mining, Cloud Solutions, Atrtificial Intelligence (künstliche Intelligenz)“ etc. sind heute aus dem Zeitalter der Digitalen Transformation nicht mehr weg zu denken. So ist es kein Geheimnis, dass in der modernen Baugruppentechnologie riesige Datenmengen anfallen. Bereits bei der Entwicklung und Konstruktion, der Materialbeschaffung und Lagerung, während der […]
Adhesives & Bonding Expo, and the co-located Foam Expo, is a unique opportunity to meet the entire adhesives and bonding supply chain and source high-performing material bonding technologies, including surface treatment, curing, bond inspection and all adhesive formulations. Learn about new market opportunities, the latest bonding processes for binding any material, and automated systems that […]
The no. 16th China Semicondcutor Association Power Discrete Form 苏州独墅湖世尊酒店 Worldhotel Grand Dushulake Suzhou 江苏省苏州市苏州工业园区启月街299号 No.299 Qiyue Street, Suzhou, 215123, Jiangsu, China
ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Berlin (Germany) from September 26-29, 2022 at the H4 Hotel Berlin Alexanderplatz. This international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for […]
The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics […]