Elektronische Baugruppen und Leiterplatten (EBL) 12th Electronic Assemblies and PCBs Conference The DVS, with its research association, organizes industrial research in the field of assembly and connection technology. Together with […]
Device Packaging The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized […]
SEMICON China connects you to the world's fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most […]
The meeting place for the whole industrial ecosystem. As a cornerstone in reindustrialization, Global Industrie symbolizes the commitment and pride of industrial players. A Showcase for Regions, know-how and the essential presence […]
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Fraunhofer Institute for Microstructure of Materials and Systems IMWS
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China ID Packaging & Testing Industry Chain Innovation Development Summit Summit Forum This event carried out a variety of activities such as summit forums, roundtables, special seminars, information releases and […]
Semiconductors are the foundation of the smart future. With its fully-established industry ecosystem and excellent talents in R&D, the Taiwan semiconductor industry is full of potentials and growth momentum in […]
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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