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Category: Newsletters

02-12-2024

Unveiling the Next Generation Sigma High Force Bond Tester

At xyztec, innovation drives everything we do. We are proud to introduce the revamped Sigma High Force (HF) bond tester, the world’s most powerful platform for high-force and

Category: Newsletters

30-10-2024

Automate Your Bond Testing with Barcode Readers

Are you ready to revolutionize your bond testing process? Xyztec has various innovative solutions that seamlessly combine the precision of our Sigma bond testers with the efficiency of

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Chronologically

Category: Articles, Newsletters

August 29, 2018

Is fully automatic bond testing possible?

Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is po

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Category: Events

März 19, 2021

First trade fairs of 2021: Semicon China & Productronica

Today is the last day to meet us at Semicon China and Productronica in the Shanghai New International Expo Centre. These exhibitions are xyztec’

Category: Events

September 24, 2020

Meet us at the Semicon Taiwan

After some viral exhibitions this year, you have the chance to meet us in person this week at the Semicon Taiwan from 23th until 25th of September at

Category: Events

Januar 17, 2020

Visit us in Tokyo this month

This week, Xyztec was at InterNepcon in Japan, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. It was

Category: Events

November 13, 2019

Visit us at Productronica

Xyztec is exhibiting at the Productronica this week from November 12th till November 15th in München, Germany. At our booth in Hall A2.316 we present

Category: Events

Oktober 3, 2019

Xyztec at EuWoRel Berlin

This week, Xyztec was at EuWoRel at Fraunhofer-Forum Berlin to present improvements in the comprehensiveness and efficiency of experimental reliabilit

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Category: News

Oktober 2, 2024

XYZTEC exhibits at 57th IMAPS: Leading Conference for Microelectronics Packaging

As in previous years, we were pleased to be one of the 101 exhibitors at the 57th IMAPS Conference-Show in Boston. Even though the organizer chose a c

Category: News

Juli 22, 2024

A fully equipped computer cabinet for a better future with perspectives

A short story of how a small secondary school in South Mozambique became xyztec’s donation partner A big project that has been planned since summer

Category: News

April 25, 2024

Annual Sales & Service Training in Bangkok: Empowering Distributors with Sigma Bond Testing Expertise

This year, for the first time, Sales & Service Training in Bangkok was held at the luxurious INNSide by Melia Bangkok Sukhumvit; the event attract

Category: News

März 21, 2024

Xyztec Makes Waves at IMAPS Scottsdale and SEMICON China

Xyztec has been making significant strides in the microelectronics industry, and our recent participation in two premier events underscores our commit

Category: News

Januar 15, 2024

Empowering young women in the electronics industry

Productronica 2023 Xyztec was part of the Productronica 2023, a premier international event for the electronics manufacturing industry in Munich from

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Category: Newsletters

Dezember 2, 2024

Unveiling the Next Generation Sigma High Force Bond Tester

At xyztec, innovation drives everything we do. We are proud to introduce the revamped Sigma High Force (HF) bond tester, the world’s most powerf

Category: Newsletters

Oktober 30, 2024

Automate Your Bond Testing with Barcode Readers

Are you ready to revolutionize your bond testing process? Xyztec has various innovative solutions that seamlessly combine the precision of our Sigma b

Category: Newsletters

September 29, 2024

What sets xyztec apart

In the realm of bond testing, only a few suppliers exist. As veterans in the field, we understand the importance of making an informed choice when it

Category: Newsletters

August 29, 2024

Redefining Precision: How xyztec Achieves Superior Force Detection

At xyztec, we are proud to be at the forefront of bond testing technology, driven by our unwavering commitment to precision and innovation. Today, we

Category: Newsletters

Juli 30, 2024

Exploring the Ball-on-Ring Test Method

In the world of materials science, testing the intrinsic strength of brittle materials like ceramics, glass, and semiconductor wafers is paramount. To

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Unterzeichnen Sie jetzt für die Newsletter und bleiben Sie auf dem aktuellen Stand der neusten Entwicklungen in der Welt des Bond-Testens und der neusten hochentwickelten Anwendungen.

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